Electronics
Aluminum Nitride's matching coefficient of thermal expansion provides a compatible mounting surface for silicon, silicon carbide, gallium nitride and gallium arsenide components in power transistor and microwave packaging applications.
Sienna can provide;
• Bare and metallized substrates
• TO-insulators (available from stock)
• Heat sinks
• Other components to
your specifications.
Also See:
Aluminum Nitride
Metallization