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Developing reliable metallization systems for Aluminum
Nitride requires ongoing materials research. Sienna Technologies, Inc.,
has made substantial efforts under both in-house
and government funded programs and made significant advances in developing
high
performance metallization technologies for Sienna's ST-family of Aluminum
Nitride.
Aluminum Nitride can be metallized through current thin and thick film
metallization technologies. It can solve heat dissipation problems in
high density
and high power electronics applications.
Refractory Molybdenum
- Manganese
Thick Film Conductor Gold
and Platinum
Thick Film Resistors
Thin Film Metallization
Hermetic Brazing
Active Metal Brazing
Glass Sealing
Sienna's technical team is ready to help you
implement Aluminum Nitride in your next
generation of products. Contact us
for
applications assistance and fast prototyping. |