Metallization
Developing reliable metallization systems for Aluminum Nitride requires ongoing materials research. Sienna Technologies, Inc., has made substantial efforts under both in-house
and government funded programs and made significant advances in developing high
performance metallization technologies for Sienna's ST-family of Aluminum Nitride.

Aluminum Nitride can be metallized through current thin and thick film metallization technologies. It can solve heat dissipation problems in high density
and high power electronics applications.

Available Metallizations:
• Refractory Molybdenum - Manganese
• Thick Film Conductor Gold and Platinum
• Thick Film Resistors
• Thin Film Metallization
• Hermetic Brazing
• Active Metal Brazing
• Glass Sealing

Sienna's technical team is ready to help you
implement Aluminum Nitride in your next
generation of products. Contact us for
applications assistance and fast prototyping.
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