Packaging for harsh environments,
and high temperature electronics
Sienna Technologies has developed a leadless robust packaging technology for
use beyond 250°C up to 600°C in harsh environments. Utilizing its unique
materials expertise to metallize and seal Aluminum Nitride and/or Alumina.
In collaboration with NASA, Sienna Technologies
successfully applied the leadless packaging
technology to develop robust MEMS
SiC pressure sensors.
Publications:
•Accelerated Stress Testing of
SiC MEMS-DCA Pressure
Transducers
•Reliability Evaluation of Direct
Chip Attached Silicon Carbide
Pressure Transducers
•Packaging Considerations for
Very High Temperature
Microsystems